New copper ink displaces electroless copper plating and other industry-standard manufacturing processes with significantly faster production speed, lower ownership cost, and greater sustainability levels
AUSTIN, Texas & SEMICON, Taiwan–BUSINESS WIRE–
Electroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced the launch of the company’s advanced conductive copper ink line. The new copper ink extends Electroninks’ global-leading portfolio of metal complex inks while providing further manufacturing flexibility and lower total ownership costs to customers. Electroninks will be showcasing the new copper ink line at booth Q5152 in Hall 2 of SEMICON Taiwan September 4-6, 2024.
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“MOD inks, which have been on the market from Electroninks for a few years now, provide unique properties that are well suited for today’s semiconductor wafer and module-based packages requiring high performance thermal and power management,” stated Jim Haley, Vice President of Marketing, IMAPS Executive Council. “By introducing a copper-based MOD product, markets and customers are generally more supportive, as copper is a standard in electronic design for many use-cases. While silver, gold, and other MOD inks will continue to serve this market, we welcome copper MOD inks to address key needs in advanced packaging.”
Electroninks is offering a range of copper ink grades to address customer demand for adhesion to various substrates, including glass, silicon, and EMC. These inks are compatible with multiple printing techniques and can be cured at low temperatures for short times – as low as 140C in 5 minutes under nitrogen or ambient conditions.
Electroninks’ corporate executives and its international sale team will be showcasing the company’s copper ink release at SEMICON Taiwan .
