On November 1, a delegation led by Rector Eva Ferreira of the University of the Basque Country (UPV/EHU) visited Tokyo Tech and met with President Kazuya Masu, Vice President for International Affairs Nobuhiro Hayashi, Institute of Innovative Research Professor Hideki Hosoda, and School of Engineering Professor Yukio Takeda. The two universities agreed to enter into an Institutional-Level Agreement and a Student Exchange Agreement with a tuition waiver provision, and a signing ceremony was held during the visit.
President Masu (3rd from left), Rector Eva Ferreira (center), Vice President Hayashi (2nd from left), Prof. Hosoda (far right), Prof. Takeda (far left), and others in the delegation
Until now, there has been a School-Level Agreements between BCMaterials (Basque Center for Materials, Applications and Nanostructures, a joint research institute of the Basque Foundation for Science and the University of the Basque Country), and Institute of Innovative Research of Tokyo Tech.
In addition, there were activities under School-Level Agreements by the Faculty of Engineering of University of the Basque Country and the School of Engineering, School of Materials and Chemical Technology, and School of Environment and Society of Tokyo Tech.
From November 2023, with the Institutional-Level Agreement, joint research and student exchanges are expected to be further stimulated.
Mutual dispatch of faculty members to conduct education and research activities at each institution based on this agreement will be of great advantage to both universities. And for students, a Student Exchange Agreement with a tuition waiver will allow them to study abroad for a year or less, expanding their choices of study abroad destinations.
Until now, Tokyo Tech has had no Institutional-Level Agreement or Student Exchange Agreement with a tuition waiver with Spanish-speaking countries, but with the conclusion of this agreement with the University of the Basque Country, further international collaboration in Spain and Spanish-speaking countries is expected in the future.
